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QS3390QG8 - Renesas Electronics

Description: The QS3390 provides a 16:8 multiplexer logic switch. The low ON resistance (5 ohm) of the QS3390 allows inputs to be connected to the outputs without adding propagation delay and without generating additional ground bounce noise. Mux/Demux devices provide an order of magnitude faster speed than equivalent logic devices. The QS3390 operates at -40C to +85C.

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QS3390QG8 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - SSOP
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QS3390QG8 - Renesas Electronics  - 3D model - Small Outline Packages - SSOP
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QS3390QG8 Details

  • Manufacturer Part Number:

    QS3390QG8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QSOP

  • Pin Count:

    28

  • Manufacturer Package Code:

    PCG28

  • Similar Group:

    LG09103611911017

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    CBT/FST/QS/5C/B

  • JESD-30 Code:

    R-PDSO-G28

  • Length:

    9.906 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS EXCHANGER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Ports:

    3

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    1.5 mA

  • Prop. Delay@Nom-Sup:

    0.25 ns

  • Propagation Delay (tpd):

    0.25 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7272 mm

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

QS3390QG8 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The thermal pad should be connected to a large copper area on the PCB to dissipate heat efficiently.
  • To ensure reliable operation across the entire operating temperature range, it is essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, the device should be properly decoupled, and the PCB should be designed to minimize thermal gradients.
  • The critical timing parameters for the QS3390QG8 include the clock frequency, setup and hold times, and propagation delay. To ensure these parameters are met, it is essential to carefully design the clock tree, ensure proper signal routing, and use the recommended termination schemes.
  • The QS3390QG8 requires a specific power sequencing and reset signal handling to ensure proper operation. The power supplies should be sequenced in a specific order, and the reset signal should be asserted for a minimum duration to ensure the device is properly reset.
  • To prevent ESD damage and latch-up, it is recommended to use ESD protection devices, such as TVS diodes, and follow proper PCB design guidelines, including the use of guard rings and ESD protection zones.

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QS3390QG8 Overview

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