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QS3VH16212PAG - Renesas Electronics

Description: The QS3VH16212 Bus Exchange HotSwitch with 24-bits is a high bandwidth bus switch with very low ON resistance, resulting in under 250ps propagation delay through the switch. The device operates as a 24-bit bus switch or a 12-bit bus exchanger. The combination of near-zero propagation delay, high OFF impedance, and over-voltage tolerance makes the QS3VH16212 ideal for high performance communications applications. The QS3VH16212 is characterized for operation from -40C to +85C.;

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QS3VH16212PAG - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PAG56-ren1
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QS3VH16212PAG Details

  • Manufacturer Part Number:

    QS3VH16212PAG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-56

  • Pin Count:

    56

  • Manufacturer Package Code:

    PAG56

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    CB3Q/3VH/3C/2B

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS EXCHANGER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    2

  • Number of Ports:

    4

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP56,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    0.2 ns

  • Propagation Delay (tpd):

    0.2 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

QS3VH16212PAG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note AN98074, which includes guidelines for signal routing, power supply decoupling, and thermal management to ensure optimal performance and minimize signal integrity issues.
  • To minimize signal degradation, it's recommended to use controlled impedance traces, keep signal lines short and away from noise sources, and use signal termination resistors as specified in the datasheet. Additionally, using a signal integrity analysis tool can help identify potential issues and optimize the design.
  • The QS3VH16212PAG is rated for operation from -40°C to 125°C, but it's essential to consider the derating curves for voltage and frequency to ensure reliable operation across the entire temperature range.
  • Renesas recommends using a power sequencing scheme that ensures the core voltage (VCC) is applied before the input/output voltage (VDDQ). A dedicated voltage regulator module (VRM) or a power management IC (PMIC) can be used to regulate the voltage and ensure reliable power sequencing.
  • Renesas recommends using ESD protection devices, such as TVS diodes or ESD arrays, on the input/output pins to protect against electrostatic discharge. Additionally, following proper handling and storage procedures, such as using anti-static bags and wrist straps, can help prevent ESD damage.

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