The recommended PCB footprint for SACB30 is a rectangular pad with a minimum size of 2.5mm x 1.5mm, with a 0.5mm radius corner and a 0.3mm spacing between pads.
Yes, SACB30 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures.
SACB30 is designed to handle high surge currents, with a maximum surge current rating of 100A. The device's internal construction and materials are designed to absorb and dissipate surge energy.
Yes, SACB30 is compatible with lead-free soldering processes, including wave soldering and reflow soldering. However, the device's peak reflow temperature should not exceed 260°C.
The typical response time of SACB30 to an overcurrent condition is less than 1ms. The device's fast response time helps to minimize damage to downstream components.
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SACB30 Overview
Use the download button to access the SACB30 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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