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SDT23C24L02 - Yageo Group

Description: ESD Suppressors / TVS Diodes TVS ESD SOT-23 24V 52V

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PCB Footprints
SDT23C24L02 - Yageo Group PCB footprint - Other - Other - SOT-23
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3D Models
SDT23C24L02 - Yageo Group  - 3D model - Other - SOT-23
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SDT23C24L02 Details

  • Manufacturer Part Number:

    SDT23C24L02

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    25 Weeks, 3 Days

  • Date Of Intro:

    2019-04-23

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    6.28

  • Breakdown Voltage-Min:

    26.7 V

  • Clamping Voltage-Max:

    52 V

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    350 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    24 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

SDT23C24L02 Frequently Asked Questions (FAQs)

  • The recommended land pattern for SDT23C24L02 is a rectangular pad with a size of 2.5mm x 1.25mm, with a solder mask opening of 2.2mm x 1.0mm.
  • SDT23C24L02 is a moisture-sensitive device. It is recommended to store it in a dry environment with a relative humidity of 20% or less. If the device is exposed to moisture, it should be baked at 125°C for 24 hours before reflow soldering.
  • The maximum reflow temperature for SDT23C24L02 is 260°C. Exceeding this temperature may cause damage to the device.
  • Yes, SDT23C24L02 is designed to withstand high-vibration environments. However, it is recommended to follow the manufacturer's guidelines for vibration testing and to ensure that the device is properly secured to the PCB.
  • To troubleshoot issues with SDT23C24L02, check the device's datasheet for common failure modes and troubleshooting guidelines. Also, verify that the device is properly soldered and that the PCB design meets the manufacturer's recommendations.

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SDT23C24L02 Overview

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