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SI4450DY - Vishay

Description: N-channel MOSFET,Si4450DY 7.5A 60V

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SI4450DY - Vishay PCB footprint - Small Outline Packages - Small Outline Packages - SOIC (NARROW) 8-LEAD
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3D Models
SI4450DY - Vishay  - 3D model - Small Outline Packages - SOIC (NARROW) 8-LEAD
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SI4450DY Details

  • Manufacturer Part Number:

    SI4450DY

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • Drain Current-Max (ID):

    7.5 A

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-609 Code:

    e0

  • Number of Elements:

    1

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.5 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

SI4450DY Frequently Asked Questions (FAQs)

  • A good PCB layout for the SI4450DY should include a large copper area for heat dissipation, with multiple vias connecting the top and bottom layers to reduce thermal resistance. A minimum of 2 oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, ensure that the device is properly mounted on a heat sink, and that the thermal interface material is applied correctly. Also, follow the recommended derating curves for current and voltage at elevated temperatures.
  • To prevent ESD damage, handle the device by the body or use an anti-static wrist strap. Ensure that the PCB has adequate ESD protection, such as TVS diodes or ESD protection arrays, and follow proper PCB design guidelines for ESD protection.
  • Yes, the SI4450DY is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards, such as AEC-Q101 or ISO 26262.
  • The recommended soldering conditions for the SI4450DY are a peak temperature of 260°C, with a soldering time of 10-30 seconds. Ensure that the soldering process is done in a nitrogen atmosphere to prevent oxidation.

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SI4450DY Overview

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