The recommended land pattern for the SM8S24AHE3_A/I can be found in the Vishay Intertechnologies' application note AN48374, which provides guidelines for PCB layout and assembly.
The SM8S24AHE3_A/I has a thermal resistance of 2.5°C/W. To handle thermal management, ensure good airflow, use a heat sink if necessary, and follow the recommended PCB layout guidelines to minimize thermal impedance.
The maximum operating temperature range for the SM8S24AHE3_A/I is -55°C to 150°C, as specified in the datasheet.
Yes, the SM8S24AHE3_A/I is a high-reliability device, suitable for use in aerospace, defense, and other high-reliability applications. It meets the requirements of MIL-PRF-19500 and is qualified to the NASA EEE-INST-002 guidelines.
Follow the recommended soldering profile and guidelines provided in the Vishay Intertechnologies' application note AN48374 to ensure proper soldering of the SM8S24AHE3_A/I.
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SM8S24AHE3_A/I Overview
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