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SRU1038A-2R2Y - Bourns

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SRU1038A-2R2Y Details

  • Manufacturer Part Number:

    SRU1038A-2R2Y

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.2

  • Case/Size Code:

    3939

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.0105 Ω

  • Inductance-Nom (L):

    2.2 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e2

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    3.8 mm

  • Package Length:

    10 mm

  • Package Style:

    SMT

  • Package Width:

    10 mm

  • Packing Method:

    TR, Embossed , 13 Inch

  • Rated Current-Max:

    6.8 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    55 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Silver/Nickel/Tin (Ag/Ni/Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    30%

SRU1038A-2R2Y Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SRU1038A-2R2Y can be found in the Bourns application note AN204, which provides guidelines for PCB layout and land pattern design.
  • The SRU1038A-2R2Y has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking and thermal management on the PCB. A thermal pad on the bottom of the device can be connected to a copper plane on the PCB to dissipate heat.
  • The recommended soldering profile for the SRU1038A-2R2Y is a peak temperature of 260°C for 10-15 seconds, with a ramp-up rate of 3°C/second and a ramp-down rate of 6°C/second. This profile ensures reliable solder joints and minimizes the risk of damage to the device.
  • Yes, the SRU1038A-2R2Y is designed to withstand high-vibration environments. However, it's essential to ensure that the device is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent damage or detachment during vibration.
  • To troubleshoot issues with the SRU1038A-2R2Y, start by verifying the device's pinout and connections. Check for any signs of physical damage, overheating, or electrical overstress. Use a multimeter to measure the device's resistance and inductance, and compare the results to the datasheet specifications. If the issue persists, consult the Bourns application notes and technical support resources for further guidance.

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SRU1038A-2R2Y Overview

Use the download button to access the SRU1038A-2R2Y 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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