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SY55852UKG - Microchip

Description: Microchip SY55852UKG D Type Flip Flop IC, 2.3 → 5.7 V, 10-Pin MSOP

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SY55852UKG Details

  • Manufacturer Part Number:

    SY55852UKG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    MSOP-10

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Family:

    55852

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Logic IC Type:

    D FLIP-FLOP

  • Moisture Sensitivity Level:

    2

  • Number of Bits:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    0.4 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.7 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Type:

    POSITIVE EDGE

  • Width:

    3 mm

  • fmax-Min:

    2500 MHz

SY55852UKG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • Use a thermal management strategy such as heat sinks, thermal interfaces, or thermal vias to keep the junction temperature below 125°C. Ensure proper airflow and avoid thermal hotspots.
  • Use a combination of high-frequency and low-frequency decoupling capacitors (e.g., 0.1 μF and 10 μF) placed close to the device. Ensure the power supply is stable and well-regulated to prevent voltage droop.
  • Use the device's power-saving features such as dynamic voltage and frequency scaling, and clock gating. Optimize the system's power management strategy to minimize idle power consumption.
  • Use controlled impedance traces, add series termination resistors, and implement EMI shielding. Ensure signal lines are routed away from noise sources and use differential signaling where possible.

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SY55852UKG Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Part Image SY55852UKGTR Micrel Inc

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Part Image SY55852UKITR Microchip Technology Inc

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Part Image SY55852UKI Microchip Technology Inc

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Part Image SY55852UKCTR Micrel Inc

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Part Image SY55852UKCTR Microchip Technology Inc

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For a full list of alternate parts for SY55852UKG, check out Findchips.com