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SZBZX84C62LT1G - onsemi

Description: 250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

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SZBZX84C62LT1G - onsemi  - 3D model
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SZBZX84C62LT1G Details

  • Manufacturer Part Number:

    SZBZX84C62LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    215 Ω

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    62 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    6.45%

  • Working Test Current:

    2 mA

SZBZX84C62LT1G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a thermal pad on the bottom of the package, connected to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, using thermal vias and a solid ground plane can also improve thermal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range (up to 150°C) and consider the device's power dissipation. Implementing thermal management techniques, such as heat sinks or thermal interfaces, can help maintain a safe operating temperature. Additionally, ensure that the PCB design and component selection are suitable for high-temperature operation.
  • The SZBZX84C62LT1G has built-in ESD protection, but it's still essential to follow proper handling and storage procedures to prevent damage. Use anti-static wrist straps, mats, and packaging materials, and avoid touching the device's pins or exposed die. Follow the recommended handling and storage guidelines outlined in the onsemi application note AND8033/D.
  • Yes, the SZBZX84C62LT1G is suitable for high-reliability and automotive applications. It's AEC-Q101 qualified and meets the requirements for automotive-grade components. However, it's essential to follow the recommended design and testing guidelines to ensure the device meets the specific application's requirements.
  • To determine the optimal biasing conditions, refer to the datasheet's recommended operating conditions and application notes. Consider factors such as the input voltage, output current, and operating temperature. You can also use onsemi's simulation tools and models to help optimize the biasing conditions for your specific application.

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SZBZX84C62LT1G Overview

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