Description:250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB
The recommended PCB footprint for the SZBZX84C6V2LT1G is a standard SOT23 package with a 1.3mm x 1.3mm pad size, 0.5mm pitch, and a thermal pad for heat dissipation.
To ensure the SZBZX84C6V2LT1G operates within its SOA, follow the recommended operating conditions, derate the power dissipation according to the thermal derating curve, and avoid exceeding the maximum junction temperature (Tj) of 150°C.
The recommended input capacitor value for the SZBZX84C6V2LT1G is 1-10uF, depending on the specific application and noise requirements. A higher capacitance value can help reduce input voltage ripple and noise.
The SZBZX84C6V2LT1G is rated for operation up to 125°C, but it's essential to consider the device's power dissipation, thermal resistance, and junction temperature (Tj) when operating in high-temperature environments.
To ensure ESD protection for the SZBZX84C6V2LT1G, follow proper handling and storage procedures, use ESD-protective packaging, and consider adding external ESD protection devices or circuits in the application.
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SZBZX84C6V2LT1G Overview
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