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TD62083AP - Toshiba

Description: IC, interface driver, Darlington, Octal

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TD62083AP - Toshiba  - 3D model
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TD62083AP Details

  • Manufacturer Part Number:

    TD62083AP

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    DIP-18

  • Pin Count:

    18

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    0

  • Additional Feature:

    LENGTH IS MAX VALUE

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    8

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDIP-T18

  • Length:

    25.1 mm

  • Number of Functions:

    1

  • Number of Terminals:

    18

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-COLLECTOR

  • Output Current Flow Direction:

    SINK

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP18,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Seated Height-Max:

    4.45 mm

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

TD62083AP Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the TD62083AP is 4.5V to 5.5V.
  • To ensure reliable operation in high-temperature environments, it is recommended to use a heat sink and ensure good thermal conductivity between the device and the heat sink. Additionally, the device should be operated within the recommended temperature range of -40°C to 85°C.
  • The maximum current rating for the TD62083AP is 1A per channel.
  • Overcurrent protection can be implemented using an external current sense resistor and a comparator or a dedicated overcurrent protection IC. The TD62083AP also has a built-in thermal shutdown feature that turns off the device in case of overheating.
  • To minimize EMI, it is recommended to use a multi-layer PCB with a solid ground plane, keep the device and its associated components close together, and use a shielded cable for the output. Additionally, the device should be placed away from high-frequency components and antennas.

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TD62083AP Overview

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