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TG111-E032NYLF - Halo Electronics

Description: 350µH LAN 10/100 Base-TX Pulse Transformer 1CT:1CT Surface Mount , -40°C ~ 85°C , 350µH , -40 to +85°C

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PCB Footprints
TG111-E032NYLF - Halo Electronics PCB footprint - Other - Other - SMD-24_2025-1.9
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TG111-E032NYLF Details

  • Manufacturer Part Number:

    TG111-E032NYLF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Halo Electronics Inc

  • YTEOL:

    7.29

  • Additional Feature:

    HEIGHT DIMENSION INCLUDES TERMINALS ALSO

  • Application:

    10/100 BASE-TX; ETHERNET

  • Height:

    6.35 mm

  • Isolation Voltage:

    1500 V

  • JESD-609 Code:

    e3

  • Length:

    15.24 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Primary Inductance:

    350 µH

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Transformer Type:

    DATACOM TRANSFORMER

  • Width:

    13.72 mm

TG111-E032NYLF Frequently Asked Questions (FAQs)

  • The recommended storage condition for the TG111-E032NYLF is in a dry, cool place with a temperature range of -20°C to 40°C and humidity below 60%. Avoid exposing the component to direct sunlight, moisture, or extreme temperatures.
  • To prevent ESD damage, handle the TG111-E032NYLF with an anti-static wrist strap or mat, and ensure the workspace is ESD-protected. Avoid touching the component's pins or leads, and use ESD-safe packaging and storage materials.
  • The maximum allowable voltage for the TG111-E032NYLF is 50V. Exceeding this voltage may cause permanent damage to the component.
  • The TG111-E032NYLF is rated for operation up to 125°C. However, it's recommended to derate the component's power handling and consider thermal management strategies to ensure reliable operation in high-temperature environments.
  • Use a soldering iron with a temperature range of 200°C to 250°C, and a solder with a melting point above 180°C. Apply a small amount of solder to the component's leads, and avoid overheating or applying excessive force, which can cause damage.

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TG111-E032NYLF Overview

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