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TN1215-800G-TR - STMicroelectronics

Description: Standard 12 A SCRs

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PCB Footprints
TN1215-800G-TR - STMicroelectronics PCB footprint - Other - Other - D²PAK _2022-4
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TN1215-800G-TR Details

  • Manufacturer Part Number:

    TN1215-800G-TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK

  • Package Description:

    D2PAK-3

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.48

  • Additional Feature:

    HIGH RELIABILITY

  • Case Connection:

    ANODE

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    200 V/us

  • DC Gate Trigger Current-Max:

    0.2 mA

  • DC Gate Trigger Voltage-Max:

    1.3 V

  • Holding Current-Max:

    30 mA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    2 mA

  • Moisture Sensitivity Level:

    1

  • Non-Repetitive Pk On-state Cur:

    146 A

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • On-state Current-Max:

    8000 A

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    12 A

  • Repetitive Peak Off-state Leakage Current-Max:

    5 µA

  • Repetitive Peak Off-state Voltage:

    800 V

  • Repetitive Peak Reverse Voltage:

    800 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Device Type:

    SCR

TN1215-800G-TR Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to ensure efficient heat dissipation.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal management guidelines, including proper heat sinking, airflow, and thermal interface materials.
  • STMicroelectronics recommends soldering the TN1215-800G-TR using a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 30-60 seconds.
  • While the TN1215-800G-TR is designed to be robust, it's essential to follow proper mounting and mechanical stress guidelines to ensure reliable operation in high-vibration environments.
  • To troubleshoot issues with the TN1215-800G-TR, start by verifying the power supply, checking for proper soldering and connections, and using oscilloscope measurements to identify any signal integrity issues.

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TN1215-800G-TR Overview

Use the download button to access the TN1215-800G-TR schematic symbol and PCB footprint.
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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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