The recommended PCB footprint for the VS-40HFR100 is a rectangular pad with a minimum size of 2.5 mm x 1.5 mm, with a 1.5 mm x 0.5 mm thermal pad in the center. The pad should be solder-mask defined and have a non-solder-mask-defined area of 0.5 mm around the perimeter.
To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste or flux to the PCB pads. Use a soldering technique that minimizes the risk of overheating or thermal shock, and avoid applying excessive pressure or vibration during the soldering process.
The maximum allowed voltage derating for the VS-40HFR100 is 80% of the rated voltage, which is 400 V. This means that the maximum allowed operating voltage is 320 V.
Handle the VS-40HFR100 with care to avoid mechanical stress, bending, or twisting. Store the devices in their original packaging or in a dry, cool place, away from direct sunlight and moisture. Avoid exposing the devices to extreme temperatures, humidity, or vibration during shipping.
The recommended TIM for the VS-40HFR100 is a thermal grease or thermal tape with a thermal conductivity of at least 1 W/m-K. Apply a thin, even layer of TIM to the thermal pad of the device, and ensure good contact between the device and the heat sink.
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VS-40HFR100 Overview
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