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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for WSLP0603R0150FEB
- Part Number WSLP0603R0150FEB
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
WSLP0603R0150FEB Details
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Manufacturer Part Number:
WSLP0603R0150FEB
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Compliant
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ECCN Code:
EAR99
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HTS Code:
8533.21.00.30
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Factory Lead Time:
10 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
12
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Additional Feature:
ANTI-SULFUR
WSLP0603R0150FEB Frequently Asked Questions (FAQs)
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The recommended land pattern for WSLP0603R0150FEB is a rectangular pad with a size of 0.6 mm x 0.3 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
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WSLP0603R0150FEB is rated for operation up to 150°C, but it's recommended to derate the power rating at higher temperatures. Consult the datasheet for derating curves and consult with a Vishay application engineer for specific guidance.
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WSLP0603R0150FEB is an ESD-sensitive device. Handle it with ESD-protective equipment, such as wrist straps, mats, and bags. Avoid touching the component pins, and use ESD-protected workstations and tools.
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WSLP0603R0150FEB is not hermetically sealed, so it's not recommended for use in humid or moist environments. If exposure to moisture is unavoidable, consider using a conformal coating or potting compound to protect the device.
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The recommended soldering profile for WSLP0603R0150FEB is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 20-30 seconds, and a ramp rate of 3°C/second. Consult the datasheet for more detailed guidance.
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WSLP0603R0150FEB Overview
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