XCVM1302-2LSENSVF1369 - AMD

XCVM1302-2LSENSVF1369 Details

• Manufacturer Part Number:

  XCVM1302-2LSENSVF1369

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  FCBGA-1369

• HTS Code:

  8542.31.00.30

• Factory Lead Time:

  16 Weeks

• Manufacturer:

  AMD

• JESD-30 Code:

  S-PBGA-B1369

• Length:

  35 mm

• Number of Terminals:

  1369

• Operating Temperature-Max:

  110 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  HBGA

• Package Equivalence Code:

  BGA1369,37X37,36

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, HEAT SINK/SLUG

• Seated Height-Max:

  4 mm

• Supply Voltage-Max:

  0.724 V

• Supply Voltage-Min:

  0.676 V

• Supply Voltage-Nom:

  0.7 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Form:

  BALL

• Terminal Pitch:

  0.92 mm

• Terminal Position:

  BOTTOM

• Width:

  35 mm

• uPs/uCs/Peripheral ICs Type:

  SoC