1217539-1 - TE Connectivity

Description: Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Underplating Material Brass | Contact Underplating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 150 MICIN | Contact Underplating Material Thickness 2.54 MICM | Mating Tab Width 6.35 MM | Contact Underplating Material Thickness 50 MICIN | Mating Tab Thickness .81 MM | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Terminal Size 6.35 | Terminal Orientation Straight | PCB Contact