1586041-4 - TE Connectivity

Description: Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 4 | Number of Power Positions 4 | Contact Features: Contact Retention Within Housing Without | Contact Layout Matrix | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Type Pin | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Layout Square Grid | PCB Contact Termination Area Plating Material