1586041-8 - TE Connectivity

Description: Configuration Features: Number of Positions 8 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Layout Matrix | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Type Pin | Contact Retention Within Housing Without | Contact L