2029397-1 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Power Positions 3 | Number of Positions 3 | Contact Features: Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Retention Within Housing Without | Contact Current Rating (Max) 12 AMP | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Layout Inline | PCB Contact Terminatio