2042274-2 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Vertical | Number of Signal Positions 0 | Number of Rows 1 | Number of Positions 2 | Number of Power Positions 2 | Contact Features: Contact Layout Staggered | Contact Mating Area Plating Material Thickness .076 MICM | Contact Current Rating (Max) 35 AMP | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Retention Within Housing With | PCB Contact Termination Area Plating Material Silver | Contact Mating Area