2173168-1 - TE Connectivity

Description: Configuration Features: Number of Rows 2 | Number of Power Positions 4 | Number of Signal Positions 0 | Number of Positions 4 | PCB Mount Orientation Horizontal | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 3 MICM | Contact Retention Within Housing With | Contact Type Receptacle | Contact Current Rating (Max) 20 AMP | Contact Mating Area Plating Material Thickness 76.2 MICIN | Contact Mating Area Plating Material Silver | Contact Base Material Copper