2174507-2 - TE Connectivity

Description: Body Features: Shell Plating Material Reflowed Tin over Nickel | Offset 0 MM | Connector Profile Micro | Shell Plating Finish Bright | Configuration Features: Number of Ports 1 | Number of Positions 5 | Contact Features: Contact Mating Area Plating Material Thickness 29.52 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 1.8 AMP | Contact Mating Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) .8 – 1. MM | PCB Thickness (Recommended) .031 â