2332795-1 - TE Connectivity

Description: Configuration Features: Stackable No | Number of Signal Positions 12 | Backplane Architecture Traditional Backplane | Number of Positions 21 | Number of Power Positions 9 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Gold | Contact Underplating Material Nickel | Contact Current Rating (Max) 75 AMP | Contact Type Socket | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 50 MICIN | PCB Contact Termination Area Plating Material Gold