2356320-1 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 74 | Contact Features: Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .381 MICM | Housing Features: Centerline (Pitch) .023 INCH | Centerline (Pi