2379397-2 - TE Connectivity

Description: Configuration Features: Number of Positions 74 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Base Material Copper Alloy | Contact Mating Area Plating Material Gold | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Thickness .381 MICM | Contact Current Rating (Max) 1.1 AMP | PCB Contact Termination Area Plating Material Tin | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitch) .