350428-1 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Vertical | Number of Positions 2 | Number of Power Positions 2 | Number of Rows 1 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Pre-Tin | Contact Mating Area Plating Material Thickness 150 â