350431-4 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 6 | Number of Power Positions 6 | Contact Features: Multiple Contact Types Without | Contact Layout Matrix | Contact Mating Area Plating Material Gold | Contact Retention Within Housing Without | Contact Underplating Material Thickness 50 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Tin