350790-3 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 3 | Number of Rows 1 | Number of Positions 3 | Contact Features: Contact Underplating Material Thickness 50 MICIN | Contact Layout Inline | Contact Retention Within Housing Without | Contact Underplating Material Thickness 1.27 MICM | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Type Pin | Contact Mating Area Plati