640900-1 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Vertical | Number of Positions 5 | Number of Rows 1 | Number of Power Positions 5 | Contact Features: Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Multiple Contact Types Without | Contact Layout Inline | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Current Rating (Max) 12 AMP | Contact Retention Within Housing Withou