640901-3 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Vertical | Number of Positions 5 | Number of Power Positions 5 | Number of Rows 1 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 – .91 MICM | Contact Type Socket | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 30 – 36 MICIN | C