643226-1 - TE Connectivity

Description: Configuration Features: Number of Rows 1 | Number of Power Positions 2 | Number of Positions 2 | PCB Mount Orientation Right Angle | Contact Features: Multiple Contact Types Without | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Layout Inline | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material