644753-2 - TE Connectivity

Description: Configuration Features: Number of Positions 2 | Number of Rows 1 | PCB Mount Orientation Vertical | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Underplating Material Nickel | Contact Current Rating (Max) 7 AMP | Contact Base Material Copper Alloy | Contact Type Pin | Mating Post Length 10.16 MM | Contact Layout Inline | Contact