644753-6 - TE Connectivity

Description: Configuration Features: Number of Positions 6 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Power Positions 6 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Base Material Copper Alloy | Mating Post Length 10.16 MM | Contact Underplating Material Nickel | Contact Current Rating (Max) 7 AMP | Mating Post Lengt