D1611PM3BDGUI-U - Kingston Technology

Description: • Die Density: 16Gbits • Organization – x 16 bits: 128M words x 16 bits x 8 banks – 2 pieces of 16Gb (x16) in one package (For 32Gb case) – Row Address: R0 ~ R16 – Column Address: C0 ~ C9 • Package – 200-ball FBGA • Power supply – VDD1 = 1.8V (1.70V to 1.95V) , – VDD2, VDDCA and VDDQ = 1.1V (1.06V to 1.17V) • Data rate: – 3733Mbps max. Backward compatible • Eight internal banks per channel for concurrent operation • Burst lengths (BL): 16, 32 and on-the-fly - On the fly mode is enabled by