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0015477654 - Molex

Description: 2.54mm Pitch C-Grid Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 54 Circuits, 0.38µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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0015477654 - Molex  - 3D model
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0015477654 Details

  • Manufacturer Part Number:

    0015477654

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Mexico, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.40

  • Manufacturer:

    Molex

  • Connector Type:

    BOARD CONNECTOR

  • Contact Finish Termination:

    Tin (Sn)

  • JESD-609 Code:

    e3

0015477654 Frequently Asked Questions (FAQs)

  • The recommended torque for the screw terminals is 0.5-1.5 Nm (4.4-13.3 in-lbs).
  • Yes, the contacts are gold-plated to ensure reliable connections and prevent corrosion.
  • The operating temperature range for the Molex 0015477654 connector is -40°C to 105°C (-40°F to 221°F).
  • Yes, the Molex 0015477654 connector is designed to withstand high-vibration environments, making it suitable for applications such as industrial control systems, automotive, and aerospace.
  • Yes, the Molex 0015477654 connector is suitable for both signal and power applications, with a current rating of up to 3A per contact.

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0015477654 Overview

Use the download button to access the 0015477654 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 00154, or try a keyword search, such as Headers and Edge Type Connectors

About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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