The recommended PCB footprint for the 0217002.HXP is a rectangular pad with dimensions of 1.5mm x 0.8mm, with a 0.5mm radius corner. The pad should be centered on the component and have a minimum of 0.2mm clearance around the component body.
The 0217002.HXP is rated for operation up to 150°C, but it's not recommended for use in high-temperature applications above 125°C without proper derating. Consult the datasheet for derating guidelines.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the PCB pad. Hold the component in place with tweezers and apply gentle pressure while soldering. Avoid overheating the component or PCB.
The 0217002.HXP has a maximum surge current rating of 100A for 10ms, and 50A for 100ms. Exceeding these ratings may damage the component.
The 0217002.HXP is designed for low-frequency applications up to 100kHz. For high-frequency applications above 100kHz, consult the datasheet for specific guidance or consider using a different component.
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0217002.HXP Overview
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