PRE ARCING TIME: OPEN WITHIN 20 MILLISEC AT 1000% RATED CURRENT
Blow Characteristic:
TIME LAG
Body Height:
20 mm
Body Length or Diameter:
5.2 mm
Circuit Protection Type:
ELECTRIC FUSE
Fuse Size:
5x20mm
Joule Integral-Nom:
6 J
Mounting Feature:
INLINE/HOLDER
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-55 °C
Packing Method:
BULK
Rated Breaking Capacity:
35 A
Rated Current:
1 A
Rated Voltage(AC):
250 V
Reference Standard:
CCC; CE; CSA; IEC; KC; PSE; SEMKO; UL; VDE
Surface Mount:
NO
Terminal Finish:
Nickel (Ni)
Terminal Shape:
END CAP
Trip Time or Delay:
0.02 s
0218001.HXP Frequently Asked Questions (FAQs)
The recommended PCB footprint for the 0218001.HXP is a rectangular pad with a size of 1.5mm x 0.8mm, with a 0.5mm spacing between pads.
Yes, the 0218001.HXP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures.
The 0218001.HXP is designed to handle surge currents up to 100A, making it suitable for applications where high inrush currents are expected. However, the device's surge current rating may be affected by the PCB layout and other system factors.
Yes, the 0218001.HXP is compatible with lead-free soldering processes, making it suitable for use in RoHS-compliant applications.
The typical response time of the 0218001.HXP is around 1-2 microseconds, making it suitable for applications where fast overvoltage protection is required.
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0218001.HXP Overview
Use the download button to access the 0218001.HXP 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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