Matte Tin (Sn) - reflowed over Nickel (Ni) barrier
Contact Gender:
MALE
Contact Material:
BRASS
Contact Style:
SQ PIN
Empty Shell:
NO
Filter Feature:
NO
Insulator Material:
POLYETHYLENE
JESD-609 Code:
e3
Mating Information:
MULTIPLAE MATING PARTS AVAILABLE
Mixed Contacts:
NO
Mounting Type:
BOARD
Number of Rows Loaded:
2
Operating Temperature-Max:
100 °C
Operating Temperature-Min:
-40 °C
Option:
GENERAL PURPOSE
Reference Standard:
UL
Termination Type:
SOLDER
Total Number of Contacts:
8
UL Flammability Code:
94-HB
0346900081 Frequently Asked Questions (FAQs)
The recommended mating sequence for the 0346900081 connector is to mate the keying feature first, followed by the terminals. This ensures proper alignment and prevents damage to the connector.
Yes, the 0346900081 connector is designed to withstand high-vibration environments. However, it's essential to follow proper mounting and fastening procedures to ensure the connector remains secure.
The maximum operating temperature for the 0346900081 connector is 125°C (257°F). Exceeding this temperature may affect the connector's performance and reliability.
Yes, the 0346900081 connector is designed for automated assembly processes. It features a pick-and-place compatible design and can be easily integrated into automated manufacturing lines.
The recommended torque value for the screw terminals on the 0346900081 connector is 0.5-1.5 Nm (4-12 in-lbs). Over-torquing may damage the terminals or the connector.
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0346900081 Overview
Use the download button to access the 0346900081 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 03469,
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About Molex
Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.
