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0444280403 - Molex

Description: Micro-Fit BMI Header, Surface Mount Compatible, Dual Row, Right-Angle, with Snap-in Plastic Peg PCB Lock, 4 Circuits, 0.76µm Gold (Au) Selective Plating

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0444280403 - Molex  - 3D model
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0444280403 Details

  • Manufacturer Part Number:

    0444280403

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.30

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Molex

  • YTEOL:

    8

  • Connector Type:

    BOARD CONNECTOR

  • Contact Finish Mating:

    NOT SPECIFIED

  • Contact Finish Termination:

    Tin (Sn)

  • Contact Material:

    NOT SPECIFIED

  • DIN Conformance:

    NO

  • IEC Conformance:

    NO

  • JESD-609 Code:

    e3

  • MIL Conformance:

    NO

0444280403 Frequently Asked Questions (FAQs)

  • The recommended torque for the screw terminals is 0.5-0.7 Nm (4.4-6.3 in-lbs).
  • Yes, the 0444280403 connector is designed to withstand vibrations and is suitable for use in high-vibration environments.
  • The operating temperature range for the 0444280403 connector is -40°C to 105°C (-40°F to 221°F).
  • Yes, the 0444280403 connector is designed for automated assembly and can be used with pick-and-place machines.
  • The mating cycle life of the 0444280403 connector is 500 cycles minimum.

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0444280403 Overview

Use the download button to access the 0444280403 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 04442, or try a keyword search, such as Power Connectors

About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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