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0452008.MRL - LITTELFUSE

Description: Surface Mount Fuses 72VAC 8A .0088ohms 452 NANO2

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Symbol
0452008.MRL - LITTELFUSE - PCB symbol
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PCB Footprints
0452008.MRL - LITTELFUSE PCB footprint - Fuses Chip - Fuses Chip - 0452008
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3D Models
0452008.MRL - LITTELFUSE - 3D model - Fuses Chip - 0452008
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0452008.MRL Details

  • Manufacturer Part Number:

    0452008.MRL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.10.00.40

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8.08

  • Blow Characteristic:

    TIME LAG

  • Body Breadth:

    2.69 mm

  • Body Height:

    2.69 mm

  • Body Length or Diameter:

    6.1 mm

  • Circuit Protection Type:

    ELECTRIC FUSE

  • Fuse Size:

    NANO

  • JESD-609 Code:

    e4

  • Joule Integral-Nom:

    137 J

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Packing Method:

    TR

  • Rated Breaking Capacity:

    50 A

  • Rated Current:

    8 A

  • Rated Voltage(AC):

    72 V

  • Rated Voltage(DC):

    60 V

  • Reference Standard:

    CE; CSA; CUL; UKCA; UL

  • Surface Mount:

    YES

  • Terminal Finish:

    GOLD

  • Terminal Shape:

    WRAPAROUND

  • Trip Time or Delay:

    0.002 s

0452008.MRL Frequently Asked Questions (FAQs)

  • The recommended storage temperature for the 0452008.MRL is -40°C to 125°C.
  • Yes, the 0452008.MRL is designed for high-reliability applications and meets the requirements of AEC-Q200, making it suitable for automotive and other high-reliability industries.
  • Yes, the 0452008.MRL is designed to operate in high-temperature environments up to 150°C, making it suitable for applications such as automotive, industrial, and aerospace.
  • The maximum surge current rating for the 0452008.MRL is 200A, making it suitable for applications that require high surge current protection.
  • Yes, the 0452008.MRL is compatible with lead-free soldering processes, making it suitable for use in modern electronic assemblies.

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0452008.MRL Overview

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