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0875007.MXEP - LITTELFUSE

Description: Cartridge Fuses 250V 3.6X10 SB PT PB-FREE 7A

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PCB Footprints
0875007.MXEP - LITTELFUSE PCB footprint - Other - Other - 0875007.MXEP-4
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0875007.MXEP Details

  • Manufacturer Part Number:

    0875007.MXEP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.10.00.40

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.68

  • Blow Characteristic:

    TIME LAG

  • Body Height:

    10 mm

  • Body Length or Diameter:

    3.6 mm

  • Circuit Protection Type:

    ELECTRIC FUSE

  • JESD-609 Code:

    e3

  • Joule Integral-Nom:

    106 J

  • Mounting Feature:

    THROUGH HOLE

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Packing Method:

    BULK

  • Rated Breaking Capacity:

    50 A

  • Rated Current:

    7 A

  • Rated Voltage(AC):

    250 V

  • Reference Standard:

    CSA; UL

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Shape:

    PIN WIRE

  • Trip Time or Delay:

    14400 s

0875007.MXEP Frequently Asked Questions (FAQs)

  • Littelfuse recommends a PCB layout with a solid ground plane, minimal lead lengths, and a Kelvin connection for the sense pins to ensure accurate current measurement and minimize noise.
  • The 0875007.MXEP has an internal overcurrent detection circuit that triggers the fault output when the current exceeds the specified threshold. The device will also limit the output current to prevent damage.
  • The typical response time of the 0875007.MXEP to a fault condition is around 1-2 microseconds, allowing for fast and reliable fault detection and protection.
  • Yes, the 0875007.MXEP is rated for operation up to 125°C, making it suitable for high-temperature applications. However, the device's accuracy and reliability may be affected at extreme temperatures.
  • The 0875007.MXEP has built-in EMI filtering and shielding to minimize the effects of electromagnetic interference on its operation. Additionally, proper PCB layout and shielding can further reduce EMI susceptibility.

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0875007.MXEP Overview

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