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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for 0ADKC9200-BE
- Part Number 0ADKC9200-BE
- Manufacturer BelFuse
- Pin Count 999
- Last Modified Date Jun 5, 2023 5:25 AM UTC
- Pinout / Pin List Click Here (Member Only)
0ADKC9200-BE Details
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Manufacturer Part Number:
0ADKC9200-BE
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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ECCN Code:
EAR99
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Factory Lead Time:
10 Weeks
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Manufacturer:
Bel Fuse
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YTEOL:
7.33
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Additional Feature:
RATED BREAKING CAPACITY AT 500 VDC: 300 A
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Blow Characteristic:
TIME DELAY
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Body Height:
20 mm
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Body Length or Diameter:
5.2 mm
0ADKC9200-BE Frequently Asked Questions (FAQs)
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The recommended PCB layout involves placing the component on a 2-layer or 4-layer board with a solid ground plane, and using thermal vias to dissipate heat. A thermal pad on the bottom of the component should be connected to a large copper area on the PCB to improve heat dissipation.
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To ensure reliability in high-temperature applications, it's essential to follow the recommended derating curves, ensure proper thermal management, and avoid exceeding the maximum operating temperature of 125°C. Additionally, consider using a thermally conductive interface material to improve heat transfer between the component and the PCB.
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The 0ADKC9200-BE has a built-in EMI filter that provides a high level of common-mode and differential-mode attenuation, making it suitable for use in applications requiring electromagnetic interference (EMI) filtering.
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Yes, the 0ADKC9200-BE is designed to handle high currents up to 20A, making it suitable for use in high-current applications. However, it's essential to ensure proper thermal management and follow the recommended derating curves to avoid overheating.
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The 0ADKC9200-BE should be stored in a dry, cool place, away from direct sunlight and moisture. Handling should be done with anti-static wrist straps or mats to prevent electrostatic discharge (ESD) damage.
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0ADKC9200-BE Overview
Use the download button to access the 0ADKC9200-BE 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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