The recommended PCB footprint for 0SPF008.HXR is a rectangular pad with a minimum size of 1.5mm x 0.8mm, with a 0.5mm radius corner and a 0.2mm spacing between pads.
Yes, 0SPF008.HXR is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the device is properly derated to prevent thermal runaway.
To ensure reliability in high-vibration environments, it's recommended to use a secure mounting method, such as soldering or adhesive bonding, and to follow proper PCB design and layout guidelines to minimize stress on the device.
Yes, 0SPF008.HXR is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5. However, it's essential to follow the recommended soldering profile and temperature guidelines to prevent damage to the device.
The typical response time of 0SPF008.HXR to an overcurrent event is less than 1μs, making it suitable for applications that require fast overcurrent protection.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
0SPF008.HXR Overview
Use the download button to access the 0SPF008.HXR 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 0SPF0,
or try a keyword search, such as Electric Fuses
