- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for 1.5KE33CA
- Part Number 1.5KE33CA
- Manufacturer Diotec
- Pin Count 2
- Part Category TVS Diode (Uni-directional)
- Package Category Diodes, Axial Diameter Horizontal Mounting
- Footprint Name Diodes, Axial Diameter Horizontal Mounting - 5.4x7.5
- Released Date Mar 23, 2022
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
1.5KE33CA Details
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Manufacturer Part Number:
1.5KE33CA
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Pin Count:
2
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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HTS Code:
8541.10.00.50
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Manufacturer:
Diotec Semiconductor AG
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YTEOL:
6.31
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Breakdown Voltage-Max:
34.7 V
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Breakdown Voltage-Min:
31.4 V
1.5KE33CA Frequently Asked Questions (FAQs)
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The recommended footprint and land pattern for the 1.5KE33CA can be found in the Diotec Semiconductor AG's application note or in the IPC-7351 standard. It's essential to follow the recommended footprint to ensure proper soldering and to prevent thermal and mechanical stress on the component.
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To ensure proper soldering, follow the recommended soldering profile, use a solder with a melting point below 260°C, and avoid applying excessive heat or mechanical stress during the soldering process. Additionally, inspect the solder joints for defects such as cold joints, solder bridges, or insufficient solder.
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The maximum allowable voltage derating for the 1.5KE33CA depends on the operating conditions and the desired reliability level. As a general rule, it's recommended to derate the voltage by 10-20% to ensure reliable operation and to prevent premature failure.
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The 1.5KE33CA is a TVS diode designed for transient voltage suppression, and it's not intended for high-frequency applications. Using it in a high-frequency circuit may lead to unwanted resonances, oscillations, or signal degradation. If you need a component for high-frequency applications, consider using a different component specifically designed for that purpose.
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The 1.5KE33CA has a limited power dissipation capability, and it's essential to ensure proper heat dissipation to prevent overheating. Use a heat sink or a thermal pad, and ensure good airflow around the component. Also, consider the thermal resistance of the PCB and the surrounding components to prevent thermal hotspots.
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1.5KE33CA Overview
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