EXCELLENT CLAMPING CAPABILITY, HIGH RELIABILITY, LOW IMPEDANCE
Breakdown Voltage-Max:
53.6 V
Breakdown Voltage-Min:
48.5 V
Breakdown Voltage-Nom:
51 V
Case Connection:
ISOLATED
Clamping Voltage-Max:
70.1 V
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code:
O-PALF-W2
JESD-609 Code:
e3
Non-rep Peak Rev Power Dis-Max:
1500 W
Number of Elements:
1
Number of Terminals:
2
Operating Temperature-Max:
175 °C
Operating Temperature-Min:
-65 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
ROUND
Package Style:
LONG FORM
Peak Reflow Temperature (Cel):
260
Polarity:
UNIDIRECTIONAL
Power Dissipation-Max:
5 W
Qualification Status:
Not Qualified
Reference Standard:
UL RECOGNIZED
Rep Pk Reverse Voltage-Max:
43.6 V
Surface Mount:
NO
Technology:
ZENER
Terminal Finish:
Tin (Sn)
Terminal Form:
WIRE
Terminal Position:
AXIAL
1.5KE51ARL4G Frequently Asked Questions (FAQs)
The recommended footprint for the 1.5KE51ARL4G is a standard SOD-123FL package with a pad size of 0.8mm x 0.8mm and a spacing of 0.5mm between pads.
The 1.5KE51ARL4G is rated for operation up to 150°C, but it's recommended to derate the power dissipation above 125°C to ensure reliable operation. Consult the datasheet for derating curves.
Follow the recommended soldering profile: peak temperature 260°C, time above 220°C 30s, and avoid exceeding 280°C. Use a solder with a melting point above 220°C and ensure good wetting and fillet formation.
The 1.5KE51ARL4G can handle a maximum surge current of 150A (8/20μs waveform) according to the IEC 61000-4-5 standard.
Yes, but ensure that each device has its own current-limiting resistor to prevent current imbalance and potential damage. Consult the datasheet for guidance on parallel configuration.
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1.5KE51ARL4G Overview
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