HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SMC, 2 PIN
ECCN Code:
EAR99
HTS Code:
8541.10.00.50
Manufacturer:
Littelfuse Inc
YTEOL:
0
Additional Feature:
EXCELLENT CLAMPING CAPABILITY
Breakdown Voltage-Max:
29.76 V
Breakdown Voltage-Min:
24.35 V
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95 Code:
DO-214AB
JESD-30 Code:
R-PDSO-C2
JESD-609 Code:
e3
Non-rep Peak Rev Power Dis-Max:
1500 W
Number of Elements:
1
Number of Terminals:
2
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-65 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity:
BIDIRECTIONAL
Power Dissipation-Max:
6.5 W
Reference Standard:
UL RECOGNIZED
Rep Pk Reverse Voltage-Max:
23.1 V
Surface Mount:
YES
Technology:
AVALANCHE
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
C BEND
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
40
1.5SMC27C Frequently Asked Questions (FAQs)
The recommended footprint for 1.5SMC27C is a rectangular pad with dimensions of 5.08mm x 2.54mm, with a solder mask defined around the pad to prevent solder bridging.
While the 1.5SMC27C is rated for operation up to 150°C, it's recommended to derate the component's voltage and current ratings for high-temperature applications. Consult the datasheet for specific derating guidelines.
To prevent ESD damage, handle 1.5SMC27C components in an ESD-protected environment, and use ESD-protective wrist straps, mats, and packaging materials.
While the 1.5SMC27C is designed for general-purpose use, it may not be suitable for high-frequency applications due to its internal construction and parasitic elements. Consult the datasheet for specific guidance on high-frequency use.
The recommended soldering process for 1.5SMC27C is a peak temperature of 260°C for 10-15 seconds, with a soldering iron or reflow oven. Consult the datasheet for specific soldering guidelines.
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1.5SMC27C Overview
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