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1.5SMC6.8AT3 - onsemi

Description: TVS DIODE 5.8V 10.5V SMC

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Symbol
1.5SMC6.8AT3 - onsemi - PCB symbol
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PCB Footprints
1.5SMC6.8AT3 - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMC CASE403-03
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3D Models
1.5SMC6.8AT3 - onsemi - 3D model - Diodes Moulded - SMC CASE403-03
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1.5SMC6.8AT3 Details

  • Manufacturer Part Number:

    1.5SMC6.8AT3

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    PLASTIC, CASE 403-03, SMC, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    CASE 403-03

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    HIGH RELIABILITY

  • Breakdown Voltage-Max:

    7.14 V

  • Breakdown Voltage-Min:

    6.45 V

  • Breakdown Voltage-Nom:

    6.8 V

  • Clamping Voltage-Max:

    10.5 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    3.5 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e0

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    1500 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    235

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.75 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    5.8 V

  • Reverse Current-Max:

    1000 µA

  • Reverse Test Voltage:

    5.8 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

1.5SMC6.8AT3 Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the 1.5SMC6.8AT3 can be found in the onsemi application note AND8321/D, which provides guidelines for surface mount assembly of onsemi's SMC package devices.
  • To ensure optimal reliability, handle the 1.5SMC6.8AT3 by the body, avoid touching the leads, and store the devices in an anti-static environment. Follow proper electrostatic discharge (ESD) precautions when handling the devices.
  • The maximum allowable voltage stress on the 1.5SMC6.8AT3 is 10% above the rated voltage, but not to exceed 150% of the rated voltage for a maximum of 30 seconds.
  • Yes, the 1.5SMC6.8AT3 is rated for operation up to 150°C, but the device's performance and reliability may degrade at high temperatures. Consult the datasheet and onsemi's application notes for guidance on high-temperature operation.
  • The power dissipation and thermal resistance of the 1.5SMC6.8AT3 can be determined using the device's thermal characteristics, such as thermal resistance (RθJA) and junction-to-ambient thermal resistance (RθJC). Consult the datasheet and onsemi's application notes for guidance.

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1.5SMC6.8AT3 Overview

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