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104CDMCCDS-100MC - Sumida

Description: Fixed Inductors 10uH 20% 30mOhms Metal Composite

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PCB Footprints
104CDMCCDS-100MC - Sumida PCB footprint - Other - Other - 104CDMCCDS-100MC-1
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3D Models
104CDMCCDS-100MC - Sumida  - 3D model - Other - 104CDMCCDS-100MC-1
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104CDMCCDS-100MC Details

  • Manufacturer Part Number:

    104CDMCCDS-100MC

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    29 Weeks

  • Manufacturer:

    Sumida Corporation

  • YTEOL:

    6.9

  • Case/Size Code:

    4539

  • Construction:

    Rectangular

  • DC Resistance:

    0.03 Ω

  • Inductance-Nom (L):

    10 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    3.8 mm

  • Package Length:

    11.5 mm

  • Package Style:

    SMT

  • Package Width:

    10 mm

  • Packing Method:

    TR

  • Rated Current-Max:

    7.5 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

104CDMCCDS-100MC Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The component should be placed near the power source and away from high-frequency components.
  • Ensure proper thermal management by providing adequate heat sinking and airflow. Derate the component's power rating according to the temperature derating curve provided in the datasheet.
  • The maximum allowable voltage transient is 1.5 times the rated voltage for a duration of 100ms. Exceeding this may damage the component.
  • Yes, but ensure that the components are matched in terms of inductance and resistance to avoid uneven current sharing. A common busbar or PCB track is recommended to minimize inductance.
  • Use a thermal imaging camera to identify hotspots. Measure the inductance using an impedance analyzer or an LCR meter. Check for soldering issues, PCB layout, and component orientation.

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104CDMCCDS-100MC Overview

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