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104CDMCCDS-1R5MC - Sumida

Description: Power Inductors - SMD 1.5uH 20% 4.2mOhms Metal Composite

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PCB Footprints
104CDMCCDS-1R5MC - Sumida PCB footprint - Other - Other - 104CDMCCDS-1R5MC-4
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3D Models
104CDMCCDS-1R5MC - Sumida  - 3D model - Other - 104CDMCCDS-1R5MC-4
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104CDMCCDS-1R5MC Details

  • Manufacturer Part Number:

    104CDMCCDS-1R5MC

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    29 Weeks

  • Manufacturer:

    Sumida Corporation

  • YTEOL:

    7

  • Case/Size Code:

    4539

  • Construction:

    Rectangular

  • DC Resistance:

    0.0038 Ω

  • Inductance-Nom (L):

    1.5 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    3.8 mm

  • Package Length:

    11.5 mm

  • Package Style:

    SMT

  • Package Width:

    10 mm

  • Packing Method:

    TR

  • Rated Current-Max:

    19 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

104CDMCCDS-1R5MC Frequently Asked Questions (FAQs)

  • The recommended PCB layout and land pattern can be found in the manufacturer's application notes or by contacting their technical support. A general guideline is to follow the IPC-7351 standard for land pattern design and to ensure a solid ground plane under the component.
  • To ensure reliability and prevent overheating, follow the recommended operating conditions, derate the component according to the datasheet, and ensure good thermal management through proper PCB design and heat sinking.
  • The component's EMI and EMC performance can be improved by following proper PCB design practices, such as using a solid ground plane, minimizing loop areas, and using shielding and filtering as necessary. Consult the manufacturer's application notes and relevant industry standards for more information.
  • The component's mechanical robustness can be evaluated by consulting the manufacturer's reliability data and environmental testing results. Additional testing and validation may be necessary to ensure the component's performance in high-vibration or high-shock environments.
  • The component's moisture sensitivity level (MSL) and storage requirements can be found in the manufacturer's datasheet or by contacting their technical support. Proper storage and handling procedures should be followed to prevent damage and ensure reliability.

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104CDMCCDS-1R5MC Overview

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